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ANT-2.45-CHP-x
2.45GHz ULTRA COMPACT CHIP ANTENNA DATA GUIDE
DESCRIPTION
The exciting ANT-2.45-CHP is of the one of the world's smallest, high-performance 2.4 Ghz Chip Antennas. It is ideal for all 2.4GHz applications including Bluetooth, 802.11, home RF, ZigBee and other popular and emerging standards. The antenna uses an advanced multilayer LTCC Technology and a proprietary hybrid spiral element to achieve size and performance characteristics superior to other designs. The incredibly compact SMD package measures a mere 6.5mm (L) x 2.2mm (W) x 1.0mm (H) and is fully compatible with hand- and reflowattachment processes. The antenna's favorable electrical specifications, stability and costeffectiveness make it the logical choice for a wide variety of applications. PHYSICAL DIMENSIONS
2.4
1.0mm 0.4mm 6.5mm 2.2mm
Actual Size
Pad Layout
0.260" 0.100" 0.040"
FEATURES
Incredibly Compact SMD Package Superior LTCC Technology 50 Characteristic Impedance Low Loss Wide Bandwidth Favorable Linear Polarization > Unity Gain No External Matching Required Highly Stable Over Temp. and Humidity Fully Hand- and Reflow-Assembly Compatible Cost-Effective
APPLICATIONS
Any 2.4GHz Wireless Product Including: Bluetooth 802.11 ZigBee Wireless PCMCIA Cards Telemetry Data Collection Industrial Process Monitoring Compact Wireless Products External Antenna Elimination
ORDERING INFORMATION
PART #
ANT-2.45-CHP-x
DESCRIPTION
2.45GHz Ultra-Compact Chip Antenna
x= "T" for Tape/Reel, "B" for Bulk Standard Reel is 3,000 pcs. Quantities less than 3,000 pcs. supplied in Bulk.
Revised 5/2/03
SPECIFICATIONS
PHYSICAL SPECIFICATIONS Dimensions 6.5 x 2.2 x 1.0 Operating Temperature -25~85C Construction LTCC ELECTRICAL PERFORMANCE Polarization Linear Operating Frequency 2,400~2,488 Center Frequency 2,450 MHz Bandwidth 180.0 MHz Maximum Gain 0.8dBi Impedance 50
CHARACTERISTICS
Impedance Return Loss
Radiation Pattern
0 0 -10 -20 -30 300 60
2.4
[deg.]
30
330
E_pl.(y-x) H_pl.(x-z) ref Dipole
y
dB -40
-30 -20 -10 0
270
90
x z
240
120
210 180
150
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SOLDERING CONSIDERATIONS
Hand Soldering This antenna is designed for high-volume automated assembly, however, it may be successfully attached by hand assembly techniques. A hand-solder temperature of 225 or lower should be used. Do not exceed a 10 sec. heating time. Reflow Temperature Profile The single most critical stage in the automated assembly process is the reflow process. The reflow profile below should be closely followed since excessive temperatures or transport times during reflow will irreparably damage the antennas. Assembly personnel will need to pay careful attention to the oven's profile to insure that it meets the requirements necessary to successfully reflow all components while still meeting the limits mandated by the antennas themselves.
REFLOW SOLDERING PROFILE
preheating 100sec max
230C
soldering 10sec max
cooling 60sec min
200C
20sec min
150C 60sec min
FLOW SOLDERING PROFILE
preheating 100sec
dipping 2 0.5sec
cooling 60sec min
235 C
150 C 60sec min
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U.S. CORPORATE HEADQUARTERS:
LINX TECHNOLOGIES, INC.
575 S.E. ASHLEY PLACE GRANTS PASS, OR 97526
Phone: (541) 471-6256 FAX: (541) 471-6251
http://www.linxtechnologies.com
Disclaimer
Linx Technologies is continually striving to improve the quality and function of its products; for this reason, we reserve the right to make changes without notice. The information contained in this Data Sheet is believed to be accurate as of the time of publication. Specifications are based on representative lot samples. Values may vary from lot to lot and are not guaranteed. Linx Technologies makes no guarantee, warranty, or representation regarding the suitability of any product for use in a specific application. None of these devices is intended for use in applications of a critical nature where the safety of life or property is at risk. The user assumes full liability for the use of product in such applications. Under no conditions will Linx Technologies be responsible for losses arising from the use or failure of the device in any application, other than the repair, replacement, or refund limited to the original product purchase price. Some devices described in this publication are patented. Under no circumstances shall any user be conveyed any license or right to the use or ownership of these patents.
(c) 2002 by Linx Technologies, Inc. The stylized Linx logo, Linx, and "Wireless Made Simple" are the trademarks of Linx Technologies, Inc. Printed in U.S.A.
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